Sep. 29, 2023
I-PEX Inc. (Head Office: Kyoto City, Kyoto Prefecture; Representative Director, President and Executive Officer : Takaharu Tsuchiyama; Tokyo Stock Exchange Prime Market Code No.: 6640; hereinafter referred to as “I-PEX”) has developed “CABLINE®-CAP,” “CABLINE®-CA IIP PLUS,” and “DUALINE® 130-HB-D,” high-speed transmission connectors suitable for enterprise equipment such as servers and switches in data centers.
“CABLINE®-CAP” has been sold since August 2023, “CABLINE®-CA IIP PLUS” is scheduled to be released around April 2024, and “DUALINE® 130-HB-D” is scheduled to be released around October 2025.
Development background
In recent years, with the rapid advancement of high-speed transmission in enterprise equipment such as servers and switches, there has been a growing need to improve the signal integrity performance of the components used in each system.
In response to such demand, I-PEX has expanded the product lineup of the “CABLINE® Series” of micro-coaxial connectors, which has a proven track record in high-speed transmission for PCs such as laptops, and that of the “DUALINE® Series” which uses Twinax cables with excellent signal integrity performance. We have also developed “LIGHTPASS® Series” products that are active optical modules for optical interconnection applications used in data centers and applications under the IOWN* concept. Thus, we are working on creating products that can cope with the increase in communication volume and speed.
All of the newly developed products have a compact design that allows the connector to be placed under the heat sink, contributing to reduction of transmission loss and space saving on the substrate. In addition, jumper cables can be placed lower than with conventional connectors. This enables the use of previously unused space on the substrate, enabling more efficient heat dissipation and achieving stable high-speed transmission in high-temperature environments. In particular, jumper wiring from expansion cards such as DPU*and NIC* corresponding to PCIe Gen5 and Gen6 used in servers contributes to the reduction of data traffic through CEM*.
- ﹡IOWN: IOWN (Innovative Optical and Wireless Network) is a next-generation backbone network concept centered on photonics-electronics convergence technology and optical communication technology promoted by the NTT Group. I-PEX participates in the IOWN Global Forum as a general member.
- ﹡DPU: Data processing unit
- ﹡NIC: Network interface card
- ﹡CEM: Card electro-mechanical slot
Overview of the new products
CABLINE®-CAP
By adopting paddle card technology in the cable plug part of the CABLINE® series of micro-coaxial connectors, we have increased the transmission performance from 20 Gbps NRZ to 64 Gbps PAM4, expanding the product's application area to the enterprise market.
Features
- Compatible with high-speed transmission 64 Gbps/lane PAM4 by creating a substrate (FPC) (paddle card) to function as a plug connector and optimizing the transmission characteristics for high frequencies.
- Small design ideal for applications with space constraints
- LEAPWIRE® jumper solution using micro-coaxial cables
Specifications
Mating type |
Horizontal
|
---|---|
Pitch |
1.2 mm (differential pair) * 0.4 mm (signal contacts)
|
Number of pins |
50 pin (up to 16 differential pairs)
|
Height |
1.15 mm
|
Depth |
6.86 mm
|
Width |
25.75 mm
|
Cable |
Micro-coaxial AWG #38
|
Lock mechanism |
Mechanical lock
|
Webpage for technical details of paddle cards
Webpage for CABLINE®-CAP products
CABLINE®-CA IIP PLUS (under development)
By adopting paddle card technology in the cable plug part of the CABLINE® series of micro-coaxial connectors, we have increased the transmission performance from 20 Gbps NRZ to over 64 Gbps PAM4, expanding the product's application area to the enterprise market. Transmission distance has been extended by making it possible to use Twinax cable in addition to micro-coaxial cable.
Features
- Compatible with high-speed transmission 64 Gbps/lane PAM4 by creating a substrate (FPC) (paddle card) to function as a plug connector and optimizing the transmission characteristics for high frequencies.
- Small design ideal for applications with space constraints
- ZenShield®* comes with a full shield cover
- LEAPWIRE® jumper solution for which not only micro-coaxial cables but also Twinax cables can be used
Specifications
Mating type |
Horizontal
|
---|---|
Pitch |
1.2 mm (differential pair) * 0.4 mm (signal contacts)
|
Number of pins |
60 pin (up to 19 differential pairs)
|
Height |
1.14 mm
|
Depth |
8.20 mm
|
Width |
30.95 mm
|
Cable |
Micro coaxial AWG #38 & Twinax AWG #34
|
Lock mechanism |
Mechanical lock
|
- ﹡ZenShield® is a solution that achieves excellent EMC measures. In particular, in electronic devices equipped with wireless communication functions that require countermeasures against intra-system EMC problems, it is possible to freely design the substrate, such as placing the connector near the antenna.
DUALINE® 130-HB-D (under development)
The DUALINE® series, which realizes 112 Gbps PAM4 transmission in a small and low profile, has an even narrower pitch (1.95 to 1.3 mm, *signal contact pitch 0.4 mm) than the current product (DUALINE®195-HB), and is now a horizontally mating double-row type. By doing so, we have achieved a high density of 32 lanes while occupying about half the board area compared to current models.
Features
- Compatible with high-speed transmission 112 Gbps/lane PAM4 by Twinax cables that reduce transmission loss
- Ideal for applications with space constraints and double row cables arranged in two vertical rows
- LEAPWIRE® jumper solution using Twinax cables
Specifications
Mating type |
Horizontal
|
---|---|
Pitch |
1.3 mm (differential pair) * 0.4 mm (signal contacts)
|
Number of pins |
64 pin (16 differential pairs x 2 rows = 32 pairs)
|
Height |
3.10 mm
|
Depth |
8.70 mm
|
Width |
26.90 mm
|
Cable |
Twinax AWG #34
|
Lock mechanism |
Mechanical lock
|
- ﹡Since “CABLINE®-CA IIP PLUS” and “DUALINE®130-HB-D” are under development, their specifications are subject to change.
About LEAPWIRE®
LEAPWIRE® is a high-speed transmission jumper solution provided by I-PEX. Compared to conventional substrate transmission methods, in addition to being able to place the connector underneath the heat sink closer to the ASIC, direct connection to the I/O connector is also possible, contributing to reduction of transmission loss.