Semiconductor Manufacturing Equipment
We manufacture and sell semiconductor molding machines. these machines are for the protection of integrated circuits embedded in semiconductors (silicon) through use of special resin molding under the I-PEX brand (formerly the Dai-ichi Seiko brand) .
In 1980, the world's first fully automatic semiconductor molding equipment was launched and delivered to semiconductor manufacturers worldwide. Since then, we have received support from many manufacturers as a result of our creation and improvement activities with customers.
Strengths and features
Manufacturing equipment made by a company that is knowledgeable in mass production
Broad customer base and support for customization
Track record as a long-term supplier, and offering reliable customer support for the global network base
List of products
Semiconductor molding machines
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GP-PRO SP Series
An automatic molding system suitable for mass production.
The company has implemented thorough dust protection to enhance reliability and meets a wide range of needs for high quality, from consumer ICs to automotive ICs and passive components.
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GP-PRO sf Series
A compact, full-automatic molding system dedicated to high-mix low-volume production.
The sf40 (one-strip type), and two sf120 models (two-strip type) are available.
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GP-PRO sa Series
Automatically transfers the lead frame and resin to the mold which are then automatically processed.
After molding, the product is removed manually in a two-strip semi-automatic molding system.
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GP-PRO LAB Series
A manual molding system that offers a wide range of options from development to specialized applications.
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S･Pot
A molding machine for device development, which uses a compact mold. It is tabletop-ready, easy-to-handle, and has a small form-factor. Prototype molding can be made in a short period of time and at a low price, making it a flexible device for developing new packages.
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GP Molds
Precision molds for semiconductor packaging. Our unique Clamp Control Floating Chase (CCFC) and other mechanisms are available to handle all packages.
Semiconductor related equipment
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TS-PRO
TS-PRO is a machine that is a global standard for applying Quad Flat No leaded package (QFN) back tape.
By applying back tape after wire bonding, the problems that occur relating to tape are solved, and it contributes to substantial cost reductions.
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DS-PRO
A machine that automatically strips QFN back tape. Compatible with both slit and stack magazines. The machine automatically strips off tape that has been securely applied.
