I-PEX Inc. (Headquarters: Kyoto City, Kyoto Prefecture; Representative Director and President: Reiji Konishi; hereinafter referred to as I-PEX) has developed the "NOVASTACK® 35-HDP 12," the first board-to-board connector in the "NOVASTACK®" series to adopt a mating height of 1.2 mm, and will begin sales on May 15, 2026.
The "NOVASTACK® 35-HDP 12" is a new product that changes the mating height from the existing "NOVASTACK® 35-HDP" (0.7 mm mating height) to 1.2 mm. It adopts a fully shielded structure using I-PEX's EMC countermeasure solution "ZenShield®" and meets a wide range of requirements for board-to-board connectors from design to assembly processes.
Board-to-board connector "NOVASTACK® 35-HDP 12"Click here for the product page of "NOVASTACK® 35-HDP 12"
Development Background
Board-to-board connectors require not only electrical performance such as high-speed signal transmission, but also mating ease, mechanical strength, and connection reliability. In recent years, it has become important in product selection not only to individually meet these performance requirements, but also to have a well-balanced overall design.
I-PEX has developed the "NOVASTACK®" series as a board-to-board connector that meets these requirements.
This time, with the aim of further increasing the degree of freedom in our customers' PCB design, we have developed "NOVASTACK® 35-HDP 12" by adding a mating height of 1.2 mm to the existing "NOVASTACK® 35-HDP" (mating height 0.7 mm), which is the first time a mating height of 1.2 mm has been added to the "NOVASTACK®" series.
Features
- Excellent mating workability and high connection reliability thanks to the adoption of a mating height of 1.2 mm.
- By employing power contacts and "ZenShield®," a compact connector suitable for high-density mounting has been realized.
- Supports high-speed signal transmission of 40 Gbps/lane.
About NOVASTACK®
NOVASTACK® is I-PEX's board-to-board connector series that meets diverse requirements such as high-speed signal transmission and power supply. It offers a product lineup that comprehensively satisfies electrical performance, mechanical reliability, and mating ease.
Click here for details on the "NOVASTACK® series"
About ZenShield®
ZenShield® is a solution that provides superior EMC protection for I-PEX's small connectors. Connectors employing ZenShield® technology allow for flexible board design, such as placing connectors near antennas, which is particularly important in electronic devices with wireless communication functions where intra-system EMC issues are a concern.
Click here for details on "ZenShield®"
About I-PEX Inc.
I-PEX stands for “Innovative Product development & Engineering solutions eXpert” providing value in the form of inspiration and astonishment in the global marketplace. The company was founded in 1963 as Dai-ichi Seiko, a precision mold manufacturer, and has since produced numerous world-firsts and unique products and solutions. I-PEX currently operates in five business fields: Connectors, Contract Manufacturing (Automotive Components & Electronics Components), Molds & Equipment, MEMS Foundry, and Energy Solutions. By delivering the sharpest tip to the world, we will contribute to exciting value-creation in the digitalized society by working globally with every customer who opens up the new era.
| Trade Name | I-PEX Inc. |
|---|---|
| President | Representative Director and President Reiji Konishi |
| Location | 5th Hase Building, 7th Floor, 637 Suiginya-cho, Shimogyo-ku, Kyoto 600-8411 |
| Establishment | July 10, 1963 |
| Paid-in Capital | 9,968 million yen (as of December 31, 2025) |
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| URL | https://corp.i-pex.com/en |