GP-PRO sa Series

Semi-automatic molding equipment with a simple structure

The "sa series" is a two-strip semi-auto molding system where product removal is conducted manually only after molding.

It is ideal for high-mix low-volume production, combining high productivity, which is comparable to the auto molding system, with a low price and low running costs.

Feature 1: Easy operation with a simple structure

With its simple structure, easy operation through plug-and-play and high maintainability have been realized. Operators do not need to be skilled in their work and can operate the system with short-term training.

Feature 2: Automatic product loading

The frame is automatically transported from the slit magazine and loaded into the mold. The tablet is also automatically loaded into the mold, eliminating the need for the operator to touch the product before molding. Pre-heaters are also installed as standard equipment.

Additional mold cleaner units are available for automatic mold cleaning as an option.
A degate jig is suggested as a separate unit for the degate operation.

Feature 3: A variety of molding options

HFC (bottom-mold movable CAV system)

When using BGA substrates, which are prone to generate substrate thickness variations at the material stage, the HFC mechanism can be installed to float the bottom mold and absorb thickness variations.

VAM (vacuum assisted molding)

If air bubbles cannot be easily removed when using complex packaging and gate shapes, complex resin viscosity characteristics, and transparent resins, a wide range of molding conditions can be added with the decompression mechanism option.


Clamp Force Model Name(press) Machine Size(mm) Weight Max. L/F Size(mm)
120ton GP-PRO sa120 (1press) W:1200×L:1300×H:1980 3.3ton 75×270

List of products

Semiconductor molding machines

Semiconductor related equipment