GP-PRO sa Series
Semi-automatic molding equipment with a simple structure
The "sa series" is a two-strip semi-auto molding system where product removal is conducted manually only after molding.
It is ideal for high-mix low-volume production, combining high productivity, which is comparable to the auto molding system, with a low price and low running costs.
Feature 1: Easy operation with a simple structure
With its simple structure, easy operation through plug-and-play and high maintainability have been realized. Operators do not need to be skilled in their work and can operate the system with short-term training.
Feature 2: Automatic product loading
The frame is automatically transported from the slit magazine and loaded into the mold. The tablet is also automatically loaded into the mold, eliminating the need for the operator to touch the product before molding. Pre-heaters are also installed as standard equipment.
Additional mold cleaner units are available for automatic mold cleaning as an option.
A degate jig is suggested as a separate unit for the degate operation.
Feature 3: A variety of molding options
HFC (bottom-mold movable CAV system)
VAM (vacuum assisted molding)
Specifications
| Clamp Force | Model Name（press） | Machine Size（mm） | Weight | Max. L/F Size（mm） | |
|---|---|---|---|---|---|
| 120ton | GP-PRO sa120 | （1press） | W:1200×L:1300×H:1980 | 3.3ton | 75×270 |
List of products
Semiconductor molding machines
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GP-PRO SP Series
An automatic molding system suitable for mass production.
The company has implemented thorough dust protection to enhance reliability and meets a wide range of needs for high quality, from consumer ICs to automotive ICs and passive components.
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GP-PRO sf Series
A compact, full-automatic molding system dedicated to high-mix low-volume production.
The sf40 (one-strip type), and two sf120 models (two-strip type) are available.
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GP-PRO LAB Series
A manual molding system that offers a wide range of options from development to specialized applications.
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S･Pot
A molding machine for device development, which uses a compact mold. It is tabletop-ready, easy-to-handle, and has a small form-factor. Prototype molding can be made in a short period of time and at a low price, making it a flexible device for developing new packages.
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GP Molds
Precision molds for semiconductor packaging. Our unique Clamp Control Floating Chase (CCFC) and other mechanisms are available to handle all packages.
Semiconductor related equipment
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TS-PRO
TS-PRO is a machine that is a global standard for applying Quad Flat No leaded package (QFN) back tape.
By applying back tape after wire bonding, the problems that occur relating to tape are solved, and it contributes to substantial cost reductions.
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DS-PRO
A machine that automatically strips QFN back tape. Compatible with both slit and stack magazines. The machine automatically strips off tape that has been securely applied.
