GP-PRO LAB Series
Manual molding machine for a wide range of applications, including development and specialized applications
Three models are available: The 80-ton, 120-ton, and 170-ton. The manual machine has a simple structure and is easy-to-operate.
A wide range of packages are available with a wide range of options, while offering a low-price system.
Feature 1: Easy operation with a simple structure
With its simple structure, easy operation through plug-and-play and high maintainability have been realized. Operators do not need to be skilled in their work and can operate the system with short-term training.
Feature 2: Manual process for loading and unloading resins and products
The frame is manually loaded into the mold and the tablet is loaded with a jig, making it easy for the operator to conduct molding.
After the resin and frame have been loaded, the molding process is carried out automatically by closing the operation door and pressing the start button with both hands. After molding is complete, the mold opens and the operation is stopped. The operation door is opened and the product is removed.
Additional mold cleaner units are available for automatic mold cleaning as an option. A degate jig is suggested as a separate unit for the degate operation.
Feature 3: A variety of molding options
HFC (bottom-mold movable CAV system)
VAM (vacuum assisted molding)
PPG (Top gate system)
FAM (Film assisted system)
CCFC (Transfer compression)
CCFC is our unique technology that combines the benefits of transfer molding and compression molding.
By moving the top cavity of the mold in accordance with the resin filling timing, we can achieve narrow-gap thin molding, which is not possible with conventional transfer molding, and we can also make significant contributions to cost reductions by realizing filmless molding.
|Max. L/F Size（mm）
List of products
Semiconductor molding machines
GP-PRO SP Series
An automatic molding system suitable for mass production.
The company has implemented thorough dust protection to enhance reliability and meets a wide range of needs for high quality, from consumer ICs to automotive ICs and passive components.
GP-PRO sf Series
A compact, full-automatic molding system dedicated to high-mix low-volume production.
The sf40 (one-strip type), and two sf120 models (two-strip type) are available.
GP-PRO sa Series
Automatically transfers the lead frame and resin to the mold which are then automatically processed.
After molding, the product is removed manually in a two-strip semi-automatic molding system.
A molding machine for device development, which uses a compact mold. It is tabletop-ready, easy-to-handle, and has a small form-factor. Prototype molding can be made in a short period of time and at a low price, making it a flexible device for developing new packages.
Precision molds for semiconductor packaging. Our unique Clamp Control Floating Chase (CCFC) and other mechanisms are available to handle all packages.
Semiconductor related equipment
TS-PRO is a machine that is a global standard for applying Quad Flat No leaded package (QFN) back tape.
By applying back tape after wire bonding, the problems that occur relating to tape are solved, and it contributes to substantial cost reductions.
A machine that automatically strips QFN back tape. Compatible with both slit and stack magazines. The machine automatically strips off tape that has been securely applied.
Processes for manufacturing semiconductors
The post semiconductor manufacturing process is shown in the illustration to demonstrate the complete production process for semiconductors.
What is an automatic molding process
Automatic molding machines and the molding processes are shown in the illustration.